Unique chip design:  
  •  Better heat dissipating Cu substrate than any other substrate materials
  •  High aspect ratio chip shape for low cost LCD-BLU
  •  n-ITO transparent contact for high current spreading, brightness
  •  Honeycomb™ chip

Low-cost high throughput Cu plating:
  •  Soft buffer and hard Cu plating for high yield LLO & reliable chip handling
  •  Highly uniform thick Cu plating(> 100 μm thick Cu)
  •  Patterned plating for stress relief  

High yield LLO:
  •  Diffusing optic system for uniform beam energy distribution
  •  Stress relief epi structure

High throughput chip separation:
  •  Chemical chip separation technique
  •  Low under cut chemical separation technique