Technology
Technology Competitiveness		    
Technology Competitiveness

Patent Highlight

Key factor of Success

 

 
 Cu based substrate Vertical LED Chip
  • Superior thermal & electrical conductivity using Cu substrate
  • Cu substrate formed by electroplating: high throughput, low cost
  • Thermally very stable at high current injection (350~1050mA)
  • Easy package and heat sink design
  • Thermal Conductivity for different substrate
    •   Lateral: Sapphire: 40W/m-K
    •   Vertical using Si substrate: 150W/m-K
    •   Verticle’s Cu substrate: 430W/m-K
  
Light Output vs. Current Injection (L-I Curve Comparison)

Verticle’s chip can withstand very high current regime compare to competitors: able to make brighter LED, big
advantage for lighting application.
           
 
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